BGA-TF specialty no-clean tacky flux for BGA soldering (ROL0)

    Adjusted solids content for BGA, QFN, LGA assembly

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    STIRRI®

    TF-SGA-005-K

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    $10.62 USD
    $10.62 USD $10.62 USD
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    STIRRI-BGA-TF specialty no-clean universal tacky flux (ROL0) provides reliable soldering of BGA components, featuring BGA-balanced viscosity with an increased amount of solids. Specifically designed for BGA purposes, it addresses BGA slumping issues. However, despite its primary focus on BGAs, the flux can adequately perform also for any other soldering task, including leaded or unleaded hand-soldering with hot-air or machine soldering.

    BGA solder sphere slumping is a defect that occurs during the reflow soldering process, where the solder spheres deform and spread out, resulting in poor solder joint formation. This can lead to various issues, including:

    • Poor electrical connection: The spread-out solder spheres may not adequately contact the BGA pads, leading to increased resistance and potential electrical failures.
    • Mechanical weakness: The reduced solder volume can weaken the joint, making it more susceptible to mechanical stress and vibration.
    • Thermal fatigue: The non-ideal solder joint shape can accelerate thermal fatigue, reducing the component's lifespan.

    Several factors can contribute to BGA solder sphere slumping:

    • Excessive reflow temperature: High temperatures can cause the solder spheres to melt excessively, leading to deformation.
    • Insufficient reflow time: If the solder spheres do not have enough time to solidify properly, they can slump as they cool.
    • Poor solder flux/paste quality: Substandard solder paste can have inadequate viscosity, allowing the solder spheres to spread.
    • Component placement accuracy: Inaccurate component placement can lead to uneven solder distribution and increased slumping.
    • PCB design issues: Poor PCB design, such as inadequate thermal vias or insufficient copper thickness, can contribute to slumping.

    To prevent BGA solder sphere slumping, it is essential to:

    • Optimize the reflow profile: Carefully control the temperature and time parameters to ensure proper solder melting and solidification.
    • Use high-quality solder flux/paste: Select a solder paste with appropriate viscosity and thermal properties.
    • Ensure accurate component placement: Employ precise placement equipment and techniques to minimize misalignment.
    • Design for manufacturability: Consider factors like thermal dissipation, component placement density, and solder joint geometry during PCB design.
    • Implement quality control measures: Regularly inspect solder joints for defects and take corrective actions as needed.

    By addressing these factors, manufacturers can minimize BGA solder sphere slumping and improve the reliability of their electronic products. 

    While BGA-TF has low activity and is a safe bet, for higher activity BGA/rework consider Hydra-MA-TF resin-based synthetic REM1 tacky flux. Made for the OEM manufacturing, Hydra-MA-TF may surpass BGA-TF in assembly line industrial-grade performance.

    Product Description

    Next generation REACH-compliant universal no-clean tacky paste flux for soldering electronics. Improved formula demonstrates mighty action, smooth flow from the syringe and excellent ability to hold components in place. Clear residue is fully translucent allowing unobstructed control over the soldering process. Contains QC-Aid™ optical tracer for an immediate visual contamination inspection highlighting residues in UV/blacklight. The flux has a pleasant non-chemical scent. REACH-compliant making soldering incredibly easy and fun without harming the environment or human health. 

    Complete the assembly with STIRRI HydraCoat™ conformal nano-coating. HydraCoat shields the assembly in 8 seconds. PCB continues to work even if fully submerged! 

    Strong points:

    - Industrial-grade wetting capabilities.
    - Excellent ability to hold components in place.
    - Clear residue resisting to turn brown under high-heat.
    - Not-corrosive. No-clean - can be left on PCB.
    - Slow burning ratio - long lasting.
    - QC-Aid™ for instant visual inspection of cleaning.
    - Pleasant non-chemical scent.
    - Environmentally/health friendly.

    STIRRI® is a modern prosumer product line made in the USA to satisfy demands for next generation high-end soldering chemicals.

    TACK & VISCOSITY: Contains sufficient amount of solids to stay put on the PCB - doesn’t spread over, but also not too thick - easy to clean. Holds components in-place yet allows for an easy repositioning by hot air. Smooth flow from the syringe - suitable for industrial component placement machines as well as handcraft rework and hobby use. Suspends BGA spheres creating a perfect activation environment for soldering leaded or lead-free solder balls or SMD solder paste - all-purpose flux!

    CLARITY & ODOR: Clear residue contains QC-Aid for instant PCB contamination inspection - the aid will glow in UV highlighting remaining residues for instant spot-cleaning. QC-Aid - Everyone can QC!™.  Cloud-free translucent material provides for a consistent unobstructed view of solder joints and IC pins while offering ultimate control over the soldering process and filling the air with pleasant non-chemical scent. Quick fix without fumes extractor will only make a workshop smell nice! 

    LONGEVITY & RESIDUE: Maintains stable performance under extended exposure to heat without turning into a dark gooey goop. Suitable for multi-step assembly - get back to a project a day or two later, once heated the flux will flow again without dropping performance. Dispensed in an amber syringes protecting the flux from the harms of environment extending the shelf life up to 2 years - a single tube lasts for a very long time!

    EASY SOLDERING & DESOLDERING: Implements upgraded booster for copper ions, visually noticeable while wicking the workspace regardless of the alloy leaded or lead-free. Instant action - quickly wets lead-free or leaded alloys delivering perfect shining joints. Clear residue can be easily removed by hot air, foam swab or HydraSweep Isopropanol.

    Suitability

    Adjusted solids content for BGA, QFN, LGA assembly

    Designation

    ROL0 classification - no-clean and not corrosive. Halide-free (<0.05%). Surface insulation resistant. No copper mirror breakthrough. Low electrochemical migration (<1 decade drop)

    Viscosity

    mPa/s (Malcom @ 10 RPM/25ºC (x 10³mPa/s))

    Disclaimer

    The information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having relevant skills at their own risk. Consumers should make their own tests to determine the suitability of each product for their particular process and take safety measures. Manufacturer/resellers assume no liability for results obtained or damages incurred through the application of the data presented.

    Cleaning "No-Clean"

    “No-clean” indicates cleaning method as defined by IPC standard and does not mean that the flux leaves no residue. No-clean rather means that the flux can be left on PCB for several consecutive SMT assemblies but also won’t cause corrosion if left indefinitely. However, cleaning can be necessary and it is desirable. No-clean fluxes are easily removed using industrial solvents in ultrasonic devices or using commercially available flux residue removers like STIRRI HydraSweep™.

    Dispensing Kit

    This product does not include any Dispensing Kit - a separate purchase! 

    Dispensing Kit is an add-on for manual dispensing, used to create a pressure with a plunger similarly to a medical syringe.

    Air syringes intended for pneumatic dispensing machines use a piston stopper instead of a plunger. Do not remove the piston as it delivers the best seal preventing contact with air!

    Compliance

    This material is certified REACH-compliant - does not use any raw materials from the REACH restricted list of substances of high concern.

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    Made in the USA to the applicable industry standards 100% customer satisfaction guaranteed!

    Liquid-proof the assembly with Nano-Coating - dries in less than 8 seconds

    STIRRI HydraCoat™ is a liquid repellent making PCB liquid proof, instantly improving assembly value!

    With an impressive droplet contact angle of over 113º, this nonconducting solution creates an invisible hydrophobic shield repelling weather, humidity, moisture - coated PCB continues to function even when fully submerged!

    Broadly suited for consumer devices, automotive circuits, urban and landscaping lightning, LED, medical or electronic devices, marine, boating and yachting industries.

    Dry to touch in less than 8 seconds, self cures in 24 hrs or 10 min in 60ºC chamber.

    STIRRI's Conformal nano-coating ensures end-customer satisfaction while virtually eliminating assembly claims due to environmental or consumer liquid damages.

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