ENIG-MA-305 T3-T6 - Sn96.5.Ag3.Cu0.5 lead-free more activity low voiding no-clean solder paste 3% silver SAC305 (ROL0)
Solders SAC to ENIG PCB with Nickel/Gold (Ni/Au) plating
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Class
NC/ROL0
J-STD-005C
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Stencil
~ 12 hours
at 30-70% R/H @20-25ºC
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Tack
28-33
Tack force g/cm
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Print
140-200
Viscosity in Malcom mPA/s x10³ 10RPM @25ºC
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Dispense
110-160
Viscosity in Malcom mPA/s x10³ 10RPM @25ºC
STIRRI®
SKU:SP-SNG-020-305-3
In stock
ENIG-MA-305 T3-T6 - Sn96.5.Ag3.Cu0.5 lead-free more activity low voiding no-clean solder paste 3% silver SAC305 (ROL0)
When Gold dissolves with SAC alloy, the soldering is essentially applied to Nickel. STIRRI® EnigMA™ lead-free solder paste improves soldering silver-containing alloys to ENIG PCB with Ni/Au plating greatly reducing ENIG-specific defects.
Contains QC-Aid™ - glows in UV for instant visual QC.
Available without QC-Aid™ as OEM-56L
Suitability
Suitability
Solder Paste Viscosity
Solder Paste Viscosity
Values in Malcom @ 10 RPM/25ºC x10³ mPa/s
Printing: 140-200
Dispensing: 110-160
Stencil Life
Stencil Life
Printer Operation
Printer Operation
Print Speed: 25-100 mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary
Some adjustments may be necessary depending on process requirements
Stencil Cleaning
Stencil Cleaning
No-clean solder paste that can be left on the board for many SMT assemblies. For applications requiring cleaning, the paste can be cleaned using commercial residue removers.
Automated cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA), co-solvents and/or ultrasonic scrubbers, vapor degreaser.
Do you make this paste untraceable - without QCA?
Do you make this paste untraceable - without QCA?
UV light is for optional for QC certification only - not required for operating the paste.
However, this material is also available untraceable - without QC-Aid™, meaning no specific optical UV-tracer has been deployed. Contact us for the MPN (Manufacturing Part Number) without UV-tracer.
Storage and Handling
Storage and Handling
To obtain the maximum shelf life STIRRI Soldering Paste & Liquid Solder™ should be stored in a refrigerator between 3-8°C (37-46°F). Unopened solder paste stored at room temperature, 25°C (77°F). Syringes and cartridges should be stored in the refrigerator vertically, dispensing tip pointing down.
Allow 4-8 hours for solder paste to reach optimal operating temperature of 20-25°C (68-77°F). To avoid condensation inside solder paste - keep solder paste container sealed while warming the solder paste to operating temperature, otherwise moisture may end up inside the container and contaminate solder paste!
NEVER FREEZE SOLDER PASTE!
Safety Notice
Safety Notice
This product is designed for professional consumers. Information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having technical skill, at their own risk. Consumers should make their own tests to determine the suitability of each product for their particular process. Manufacturer or distributors will assume no liability for results obtained or damages incurred through the application of the data presented - try on a small non-critical surface first!
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Liquid-proof the assembly with Nano-Coating - dries in less than 8 seconds
STIRRI HydraCoat™ is a liquid repellent making PCB liquid proof, instantly improving assembly value!
With an impressive droplet contact angle of over 113º, this nonconducting solution creates an invisible hydrophobic shield repelling weather, humidity, moisture - coated PCB continues to function even when fully submerged!
Broadly suited for consumer devices, automotive circuits, urban and landscaping lightning, LED, medical or electronic devices, marine, boating and yachting industries.
Dry to touch in less than 8 seconds, self cures in 24 hrs or 10 min in 60ºC chamber.
STIRRI's Conformal nano-coating ensures end-customer satisfaction while virtually eliminating assembly claims due to environmental or consumer liquid damages.