Sn10Pb88Ag2 High-Temp Solder Paste • 290°C Die Attach • Aerospace RMA • RMA-HT-010

    Engineered for prolonged high-temperature reflow, semiconductor attachment, and high-performance hot air rework

      • Class

        NC/ROL0

        J-STD-005C

      • Stencil

        ~ 12 hours

        at 30-70% R/H @20-25ºC

      • Tack

        44-48

        Tack force g/cm

      • Print

        210-300

        Viscosity in Malcom mPA/s x10³ 10RPM @25ºC

      • Dispense

        100-140

        Viscosity in Malcom mPA/s x10³ 10RPM @25ºC
      1 3

      STIRRI®

      SP-SRH-020-010-3

      Mesh Type
      Size
      $29.99 USD
      $39.99 USD $29.99 USD
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      Shipping calculated at checkout.

      In stock

      Aerospace & Defense Grade High-Temperature Solder Paste

      RMA-HT-010 is a high-reliability, Rosin Mildly Activated (RMA) solder paste engineered for extreme thermal environments. Utilizing the Sn10Pb88Ag2 alloy (2% Silver), this paste features a high melting point of 290°C, making it the industry standard for semiconductor attachment and complex multi-step PCB assemblies.

      Key Technical Advantages

      • Extreme Thermal Stability: Formulated with increased solids content to withstand prolonged reflow profiles at 350°C for 5+ minutes without charring or losing flux activity.
      • hotAIRework™ Optimized: Specifically designed to maintain efficiency and clarity during hot air rework (380°C–480°C), requiring minimal top-ups due to its fire-retardant properties.
      • ROL0 Reliability: Provides the classic performance of rosin-based flux with a modern "no-clean" residue that is non-corrosive, non-conductive, and halide-free.
      • High-Joint Integrity: The 2% silver content improves thermal fatigue resistance and creates superior intermetallic bonds on high-temp substrates.

      Technical Specifications

      Alloy Composition Sn10Pb88Ag2
      Melting Range 268°C - 290°C
      Classification ROL0 (No-Clean / Rosin-Based)
      Mesh Size T3 (25-45µm)
      Tack Force 44-48 g/cm

      Applications

      • Semiconductor Die Attach: Ideal for power electronics and high-heat components.
      • Multi-Step Assembly: Perfect for first-step soldering where joints must remain solid during subsequent lower-temp reflow cycles.
      • Harsh Environments: Optimized for Down-hole, Aerospace, and Defense electronics.

      Storage: Refrigerate at 3-8°C (37-46°F) to maintain shelf life. Allow to reach room temperature before use.

      Suitability

      Solder Paste Viscosity

      Values in Malcom @ 10 RPM/25ºC x10³ mPa/s
      Printing: 210-300
      Dispensing: 100-140

      Stencil Life

      ~ 12 hours

      Printer Operation

      Print Speed: 25-100 mm/sec

      Squeegee Pressure: 70-250g/cm of blade

      Under Stencil Wipe: Once every 10-25 prints, or as necessary

      Some adjustments may be necessary depending on process requirements

      Stencil Cleaning

      No-clean solder paste that can be left on the board for many SMT assemblies. For applications requiring cleaning, the paste can be cleaned using commercial residue removers.

      Automated cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA), co-solvents and/or ultrasonic scrubbers, vapor degreaser.

      Do you make this paste untraceable - without QCA?

      UV light is for optional for QC certification only - not required for operating the paste.

      However, this material is also available untraceable - without QC-Aid™, meaning no specific optical UV-tracer has been deployed. Contact us for the MPN (Manufacturing Part Number) without UV-tracer.

      Storage and Handling

      To obtain the maximum shelf life STIRRI Soldering Paste & Liquid Solder™ should be stored in a refrigerator between 3-8°C (37-46°F). Unopened solder paste stored at room temperature, 25°C (77°F). Syringes and cartridges should be stored in the refrigerator vertically, dispensing tip pointing down.

      Allow 4-8 hours for solder paste to reach optimal operating temperature of 20-25°C (68-77°F). To avoid condensation inside solder paste - keep solder paste container sealed while warming the solder paste to operating temperature, otherwise moisture may end up inside the container and contaminate solder paste!

      NEVER FREEZE SOLDER PASTE!

      Safety Notice

      This product is designed for professional consumers. Information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having technical skill, at their own risk. Consumers should make their own tests to determine the suitability of each product for their particular process. Manufacturer or distributors will assume no liability for results obtained or damages incurred through the application of the data presented - try on a small non-critical surface first!

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      You are in good hands!

      Made in the USA to the applicable industry standards 100% customer satisfaction guaranteed!

      Liquid-proof the assembly with Nano-Coating - dries in less than 8 seconds

      STIRRI HydraCoat™ is a liquid repellent making PCB liquid proof, instantly improving assembly value!

      With an impressive droplet contact angle of over 113º, this nonconducting solution creates an invisible hydrophobic shield repelling weather, humidity, moisture - coated PCB continues to function even when fully submerged!

      Broadly suited for consumer devices, automotive circuits, urban and landscaping lightning, LED, medical or electronic devices, marine, boating and yachting industries.

      Dry to touch in less than 8 seconds, self cures in 24 hrs or 10 min in 60ºC chamber.

      STIRRI's Conformal nano-coating ensures end-customer satisfaction while virtually eliminating assembly claims due to environmental or consumer liquid damages.

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